DME iControl™ Hot Runner Insulation
What is iControl Hot Runner Insulation?
The extremely low thermal conductivity of iControl is the result of its microporous structure and the addition of opacifiers. iControl material insulates against all three methods of heat transmission: conduction, convection and radiation. Low conduction is a result of the very small silica particle agglomerates of approximately 10nm which only have a single point to touch each other. Convection heat transfer is minimized by the unique nature of the micro pores which prevent the movement of air and hence the transfer of heat. Finally, the inclusion of opacifiers minimize heat transfer due to infrared radiation.
Reducing Heat Loss & Minimizing Thermal Variation
Today’s hot runner systems rely on the use of an air gap to minimize the thermal transfer between the plates. However, air is a less effective insulator at elevated temperatures due to the property of diffusivity. The result is significant heat loss from the heated hot runner system to the adjacent cooled mold plates. This heat loss not only increases power requirements, but also negatively impacts the mold cooling process, increasing cycle time. iControl insulation can mitigate this problem due to its superior insulation properties, especially at elevated processing temperatures.
Just like a home, where it is desirable for its temperature be maintained, a thermal barrier is used to isolate the space from the surrounding environment. The thermal barrier is an insulator, and whether to keep the space hot or cool, the insulator reduces the required work of the heating or cooling system and creates a more balanced, uniform temperature within the space.
Boost Productivity – Lower energy consumption
Breakthrough in improving the performance of hot runner systems.
The unique nano microporous material of iControl Insulation helps isolate the heat, reducing the heat loss and thermal variation of the hot runner system.
Easily installed at time of original build or later as a retrofit, iControl will greatly reduce the thermal variation throughout the manifold and nozzles so the temperature of the incoming resin closely matches the temperature at entry to the cavity. Balancing the temperature across the system opens the possibility to lower both melt and mold temperatures.
Result: Less heat in means less heat out for accelerated startups and faster cycle time
Benefits of lower melt temperature:
- Faster start up times
- Reduced cycle times
- Lower energy requirements
- More homogenous melt assuring better part quality
- Optimizing process temperature protects heat sensitive materials such as optical grade resins, bioplastics and resins with high post-consumer recycled content
